october 2012 ?2012 fairchild semiconductor corporation FDMS86150 rev.c1 www.fairchildsemi.com 1 FDMS86150 n-channel powertrench ? mosfet bottom power 56 top pin 1 g s s s d d d d d d d d s s s g pin 1 FDMS86150 n-channel powertrench ? mosfet 100 v, 60 a, 4.85 m features ? max r ds(on) = 4.85 m at v gs = 10 v, i d = 16 a ? max r ds(on) = 7.8 m at v gs = 6 v, i d = 13 a ? advanced package and silicon combination for low r ds(on) and high efficiency ? msl1 robust package design ? 100% uil tested ? rohs compliant general description this n-channel mosfet is produced using fairchild semiconductor?s adv anced power trench ? process thant has been especially tailored to minimi ze the on-state resistance and yet maintain superior switching performance. applications ? primary dc-dc mosfet ? secondary synchronous rectifier ? load switch mosfet maximum ratings t a = 25 c unless otherwise noted thermal characteristics package marking and ordering information symbol parameter ratings units v ds drain to source voltage 100 v v gs gate to source voltage 20 v i d drain current -continuous t c = 25 c 60 a -continuous t a = 25 c (note 1a) 16 -pulsed 300 e as single pulse avalanche energy (note 3) 726 mj p d power dissipation t c = 25 c 156 w power dissipation t a = 25 c (note 1a) 2.7 t j , t stg operating and storage junction temperature range -55 to +150 c r jc thermal resistance, junction to case 0.8 c/w r ja thermal resistance, junction to ambient (note 1a) 45 device marking device package reel size tape width quantity FDMS86150 FDMS86150 power 56 13 ?? 12 mm 3000 units
www.fairchildsemi.com 2 ?2012 fairchild semiconductor corporation FDMS86150 rev.c1 FDMS86150 n-channel powertrench ? mosfet electrical characteristics t j = 25 c unless otherwise noted off characteristics on characteristics dynamic characteristics switching characteristics drain-source diod e characteristics symbol parameter test conditions min typ max units bv dss drain to source breakdown voltage i d = 250 a, v gs = 0 v 100 v bv dss t j breakdown voltage temperature coefficient i d = 250 a, referenced to 25 c 72 mv/c i dss zero gate voltage drain current v ds = 80 v, v gs = 0 v 1 a i gss gate to source leakage current v gs = 20 v, v ds = 0 v 100 na v gs(th) gate to source threshold voltage v gs = v ds , i d = 250 a234v v gs(th) t j gate to source threshold voltage temperature coefficient i d = 250 a, referenced to 25 c -10 mv/c r ds(on) static drain to source on resistance v gs = 10 v, i d = 16 a 3.9 4.85 m v gs = 6 v, i d = 13 a 6 7.8 v gs = 10 v, i d = 16 a, t j = 125 c 7.3 9.1 g fs forward transconductance v ds = 10 v, i d = 16 a 53 s c iss input capacitance v ds = 50 v, v gs = 0 v, f = 1 mhz 3055 4065 pf c oss output capacitance 696 930 pf c rss reverse transfer capacitance 29 50 pf r g gate resistance 0.1 0.7 3.6 t d(on) turn-on delay time v dd = 50 v, i d = 16 a, v gs = 10 v, r gen = 6 18 33 ns t r rise time 8.3 17 ns t d(off) turn-off delay time 28 45 ns t f fall time 612ns q g total gate charge v gs = 0 v to 10 v v dd = 50 v, i d = 16 a 44 62 nc q g total gate charge v gs = 0 v to 5 v 25 35 nc q gs gate to source charge 12.9 nc q gd gate to drain ?miller? charge 9.2 nc v sd source to drain diode forward voltage v gs = 0 v, i s = 2.1 a (note 2) 0.69 1.2 v v gs = 0 v, i s = 16 a (note 2) 0.78 1.3 t rr reverse recovery time i f = 16 a, di/dt = 100 a/ s 69 110 ns q rr reverse recovery charge 94 150 nc notes : 1. r ja is determined with the device mounted on a 1 in 2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of fr-4 material. r jc is guaranteed by design while r ca is determined by the user's board design. 2. pulse test: pulse width < 300 s, duty cycle < 2.0%. 3. e as of 726 mj is based on starting t j = 25 c, l = 3 mh, i as = 22 a, v dd = 100 v, v gs = 10 v, 100% test at l = 0.1 mh, i as = 69 a. a. 45 c/w when mounted on a 1 in 2 pad of 2 oz copper. b. 115 c/w when mounted on a minimum pad of 2 oz copper. g df ds sf ss g df ds sf ss
www.fairchildsemi.com 3 ?2012 fairchild semiconductor corporation FDMS86150 rev.c1 FDMS86150 n-channel powertrench ? mosfet typical characteristics t j = 25 c unless otherwise noted figure 1. 012345 0 50 100 150 200 250 300 v gs = 8 v v gs = 5 v v gs = 7 v pulse duration = 80 p s duty cycle = 0.5% max v gs = 6 v v gs = 10 v i d , drain current (a) v ds , drain to source voltage (v) on region characteristics figure 2. 0 50 100 150 200 250 300 0 1 2 3 4 v gs = 7 v v gs = 8 v v gs = 5 v pulse duration = 80 p s duty cycle = 0.5% max normalized drain to source on-resistance i d , drain current (a) v gs = 6 v v gs = 10 v n o r m a l i z e d o n - r e s i s t a n c e vs drain current and gate voltage f i g u r e 3 . n o r m a l i z e d o n r e s i s t a n c e -75 -50 -25 0 25 50 75 100 125 150 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 i d = 16 a v gs = 10 v normalized drain to source on-resistance t j , junction temperature ( o c ) vs junction temperature figure 4. 45678910 0 5 10 15 20 t j = 125 o c i d = 16 a t j = 25 o c v gs , gate to source voltage (v) r ds(on) , drain to source on-resistance ( m : ) pulse duration = 80 p s duty cycle = 0.5% max o n - r e s i s t a n c e v s g a t e t o source voltage figure 5. transfer characteristics 2345678 0 50 100 150 200 250 300 t j = 150 o c v ds = 5 v pulse duration = 80 p s duty cycle = 0.5% max t j = -55 o c t j = 25 o c i d , drain current (a) v gs , gate to source voltage (v) figure 6. 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.001 0.01 0.1 1 10 100 300 t j = -55 o c t j = 25 o c t j = 150 o c v gs = 0 v i s , reverse drain current (a) v sd , body diode forward voltage (v) s o u r c e t o d r a i n d i o d e forward voltage vs source current
www.fairchildsemi.com 4 ?2012 fairchild semiconductor corporation FDMS86150 rev.c1 FDMS86150 n-channel powertrench ? mosfet figure 7. 0 1020304050 0 2 4 6 8 10 i d = 16 a v dd = 75 v v dd = 25 v v gs , gate to source voltage (v) q g , gate charge (nc) v dd = 50 v gate charge characteristics figure 8. 0.1 1 10 100 10 100 1000 10000 f = 1 mhz v gs = 0 v capacitance (pf) v ds , drain to source voltage (v) c rss c oss c iss c a p a c i t a n c e v s d r a i n to source voltage figure 9. 0.01 0.1 1 10 100 1000 10000 100000 0.1 1 10 100 t j = 100 o c t j = 25 o c t j = 125 o c t av , time in avalanche (ms) i as , avalanche current (a) u n c l a m p e d i n d u c t i v e switching capability figure 10. 25 50 75 100 125 150 0 25 50 75 100 125 v gs = 6 v limited by package r t jc = 0.8 o c/w v gs = 10 v i d , drain current (a) t c , case temperature ( o c ) m a x i m u m c o n t i n u o u s d r a i n current vs case temperature f i g u r e 1 1 . f o r w a r d b i a s s a f e op erating area 0.01 0.1 1 10 100 500 0.01 0.1 1 10 100 300 1 s 10 ms dc 10 s 100 ms 1 ms i d , drain current (a) v ds , drain to source voltage (v) this area is limited by r ds(on) single pulse t j = max rated r t ja = 115 o c/w t a = 25 o c figure 12. 10 -3 10 -2 10 -1 110 100 1000 0.5 1 10 100 1000 single pulse r t ja = 115 o c/w t a = 25 o c v gs = 10 v p ( pk ) , peak transient power (w) t, pulse width (sec) s i n g l e p u l s e m a x i m u m power dissipation typical characteristics t j = 25 c unless otherwise noted
www.fairchildsemi.com 5 ?2012 fairchild semiconductor corporation FDMS86150 rev.c1 FDMS86150 n-channel powertrench ? mosfet figure 13. 10 -3 10 -2 10 -1 11 0 100 1000 0.001 0.01 0.1 1 single pulse r t ja = 115 o c/w duty cycle-descending order normalized thermal impedance, z t ja t, rectangular pulse duration (sec) d = 0.5 0.2 0.1 0.05 0.02 0.01 2 p dm t 1 t 2 notes: duty factor: d = t 1 /t 2 peak t j = p dm x z t ja x r t ja + t a junction-to-ambient transient thermal response curve typical characteristics t j = 25 c unless otherwise noted
www.fairchildsemi.com 6 ?2012 fairchild semiconductor corporation FDMS86150 rev.c1 FDMS86150 n-channel powertrench ? mosfet dimensional outlin e and pad layout
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